Intel packt künftige Riesen-Chips auf Glas-Träger from Heise's blog
Das bisherige Substratmaterial für Chipgehäuse stößt an Grenzen, weshalb Intel auf Glas setzt - als Trägermaterial, aber auch für optische CPU-Schnittstellen.
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| By | Heise |
| Added | Sep 18 '23, 03:42PM |
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